Solid-state image pickup apparatus having a hermetic seal portion and fabricating method thereof

A fabricating method of solid-state image pickup apparatus having a hermetic seal portion provided over a solid-state image pickup device chip comprising a flat-plate portion formed of a transparent member and a frame portion disposed at a side portion of a lower surface of the flat-plate portion, said fabricating method of solid-state image pickup apparatus including the steps of:

• over an entire wafer having a large number of solid-state image pickup device chips formed thereon, integrally and at once in a manner corresponding to each individual solid-state image pickup device chip, forming a hermetic seal portion comprising a flat-plate portion made of a transparent member, and a frame portion at least including a metal wiring disposed at a side portion of a lower surface of the flat plate portion, a bump formed on said solid-state image pickup device chip and electrically connected to the metal wiring, and a seal region for sealing the periphery of the bump by a sealing material so that the frame portion is disposed on the lower surface of the flat-plate portion where a transparent member extended over the entire wafer is used as the flat-plate portion;
• and
• separating the wafer having the hermetic seal portions formed integrally and at once thereon into solid-state image pickup device chips each having an individual hermetic seal portion.