Wiring structure, and fabrication method of the same
AssigneeCanon Kabushiki Kaisha
InventorsTakayuki Teshima, Yasuhiro Shimada
Life of this patent
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Abstract
An electrical wiring structure, such as a planar coil, includes a set of wiring formed of an electrical conductor and formed on an insulating surface of a substrate. A dam-up wall structure is provided around an outermost peripheral portion of the set of wiring on the substrate. The dam-up wall structure is electrically disconnected from the set of wiring. An insulating layer is formed over an area from the set of wiring to the dam-up wall structure on the substrate, wherein the dam-up wall structure dams up the insulating layer.
Claims9
An electrical wiring structure comprising:
- a substrate, said substrate having an insulating surface;
- a set of wiring, said set of wiring being formed of an electrical conductor, and being formed on said insulating surface of said substrate;
- a dam-up wall structure, said dam-up wall structure being electrically disconnected from said set of wiring, and being provided around an outermost peripheral portion of said set of wiring;
- and
- an insulating layer, said insulating layer being formed over an area from said set of wiring to said dam-up wall structure, wherein said dam-up wall structure dams up the insulating layer.
A fabrication method of a wiring structure, said method comprising:
- a first step of forming an electrically conductive layer on an insulating surface of a substrate;
- a second step of forming an insulating mask layer on the electrically conductive layer;
- a third step of patterning the insulating mask layer to expose the electrically conductive layer at a pattern portion of a first set of wiring and a pattern portion of a conductive wall structure;
- a fourth step of simultaneously forming the first set of wiring and the conductive wall structure, which are electrically disconnected from each other, on the electrically conductive layer at the pattern portion of the first set of wiring and the pattern portion of the conductive wall structure, respectively, using electroplating;
- a fifth step of removing the insulating mask layer;
- a sixth step of patterning the electrically conductive layer;
- and
- a seventh step of forming an insulating layer over an area from the first set of wiring to the conductive wall structure.
Dependencies are inferred from the claim text.