Vertical probe card and air cooled probe head system
AssigneeQualiTau, Inc.
InventorsMichael L. Anderson, Edward A. McCloud, Shahriar Mostarshed, Michael A. Casolo
Life of this patent
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Abstract
A probe card is vertically mounted generally perpendicular to a wafer undergoing life tests in a heated environment to limit exposure of the probe card to heat from the wafer chuck. The probe card and probe head assembly are mounted on a support rail which has one or more channels for the flow of cool air to a probe head assembly and the probe card, while it shields the flex cable from the hot chuck. The cool air flow disrupts convective hot air flow upwards from the heated chuck to the probe card and probe head and facilitates cooling of the probe card and probe head.
Claims23
A generally planar probe card for mounting generally perpendicular to a heated planar device undergoing test to reduce heat transfer to the probe card during test, said probe card comprising:
- a) a printed circuit board,
- b) a tip assembly including a plurality of probe tips on one end of the board for engaging a device undergoing test,
- c) a plurality of electrical contacts on an opposing end of the board,
- d) electrical conductors on the board for electrically connecting tips on the one end of the board to electrical contacts on the opposing end of the board, and
- e) a fastener for engaging a support above a device undergoing test with the printed circuit board in generally perpendicular alignment with the device undergoing test, whereby heat transfer from the heated device under test to the printed circuit board is reduced during test.
A probe head for mounting above a device undergoing test comprising:
- a) a printed circuit board,
- b) a tip assembly including a plurality of probe tips on one end of the board for engaging a device undergoing test,
- c) a plurality of electrical contacts on an opposing end of the board,
- d) an electrically conductive pattern on the board for electrically connecting tips on the one end of the board to electrical contacts on the opposing end of the board, and
- e) a first fastener for engaging a mounting assembly above a device undergoing test with the printed circuit board in generally perpendicular alignment with the device undergoing test, and
- f) a mounting assembly on which the printed circuit board is supported and including a second fastener for engaging the first fastener.
A forced air cooled probe head assembly for mounting a probe card generally above and perpendicular to a device undergoing electrical tests in a heated environment comprising:
- a) a probe head including a printed circuit board, a tip assembly on one end of the printed circuit board, a plurality of contacts on an opposing end of the printed circuit board, and an electrically conductive pattern interconnecting the tip assembly and the plurality of contacts, and
- b) a rail assembly for supporting the probe head, the rail assembly including at least one channel for the flow of air and openings for directing the air towards the probe head whereby convective flow of hot air can be disrupted and cooled.
Dependencies are inferred from the claim text.