Semiconductor device testing apparatus, semiconductor device testing system, and semiconductor device testing method for measuring and trimming the output impedance of driver devices
AssigneeInfineon Technologies AG
InventorGeorg Muller
Life of this patent
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Abstract
The disclosure relates to a semiconductor device testing apparatus, a semiconductor device testing system, and a semiconductor device testing method, in particular a method for measuring or trimming, respectively, the impedance of driver devices provided in a semiconductor device, wherein a device, in particular a driver device, comprising each a pull-up circuit and a pull-down circuit is used, and wherein the method includes: joint activating of both the pull-up circuit and the pull-down circuit; and determining a first current flowing through the pull-up circuit or the pull-down circuit, respectively, with jointly activated pull-up and pull-down circuits.
Claims12
A method for measuring and trimming the impedance of a driver device in a semiconductor device during a test being carried out before the regular operation of the semiconductor device, the driver device of the semiconductor device including each a pull-up circuit and a pull-down circuit, the method comprising:
- substantially simultaneously activating both the pull-up circuit and the pull-down circuit;
- and
- determining a first current flowing through the pull-up circuit or the pull-down circuit, respectively, with substantially simultaneously activated pull-up and pull down circuits during the test carried out before the regular operation of the semiconductor device.
A method for measuring and trimming the impedance of a driver device in a semiconductor device during a test being carried out before the regular operation of the semiconductor device, the driver device of the semiconductor device including each a pull-up circuit and a pull-down circuit, the method comprising:
- joint activating both the pull-up circuit and the pull-down circuit;
- and
- determining a first current flowing through the pull-up circuit or the pull-down circuit, respectively, with jointly activated pull-up and pull down circuits during the test carried out before the regular operation of the semiconductor device;
- wherein the pull-up or pull-down circuits, respectively, are connected to a supply voltage pad or a ground connection, respectively, of the semiconductor device, and the method further comprising:
- joint de-activating both the pull-up circuit and the pull-down circuit;
- and
- determining a standby current flowing between the supply voltage pad and the ground connection with jointly de-activated pull-up and pull down circuits.
Dependencies are inferred from the claim text.