Apparatus for processing semiconductor devices in a singulated form

A die carrier assembly for probe testing, comprising:

• a plurality of semiconductor dice with at least one of the plurality of semiconductor dice having at least one I/O element;
• a first substantially planar substrate including a die-side surface and an opposing back surface, the die-side surface including a plurality of die attachment areas for temporarily holding the plurality of semiconductor dice;
• at least one attachment pad associated with each die attachment area of the plurality of die attachment areas and located on the die-side surface of the first substantially planar substrate;
• a temporary bond comprising a conductive adhesive material that joins the at least one I/O element of the at least one of the plurality of semiconductor die to the at least one attachment pad;
• at least one contact pad associated with each die attachment area of the plurality of die attachment areas and located on one of the die-side surface and the back surface of the first substantially planar substrate;
• at least one conductive trace disposed on one of the die-side surface and the back surface of the first substantially planar substrate connecting the at least one attachment pad and the at least one contact pad;
• and
• a second substantially planar substrate secured to the die-side surface of the first substantially planar substrate and including at least one aperture therethrough that exposes at least one die attachment area of the plurality of die attachment areas of the die-side surface.

A die carrier assembly for probe testing, comprising:

• at least one semiconductor die having at least one I/O element;
• a first substantially planar substrate including a die-side surface with at least one die attachment area for temporarily holding at least one semiconductor die and an opposing back surface;
• a second substantially planar substrate secured to the die-side surface of the first substantially planar substrate and including at least one aperture therethrough that exposes the at least one die attachment area of the die-side surface, the second substantially planar substrate including an inner boundary defining the at least one aperture and an outer boundary;
• at least one attachment pad located on the die-side surface of the first substantially planar substrate;
• a temporary bond comprising a conductive adhesive material that joins the at least one I/O element of the at least one semiconductor die to the at least one attachment pad on the first substantially planar substrate;
• at least one contact pad located on one of the die-side surface and the back surface of the first substantially planar substrate, the at least one contact pad being disposed laterally outside the outer boundary of the second substantially planar substrate;
• and
• at least one conductive trace connecting the at least one attachment pad and the at least one contact pad.