Miniaturized contact spring

An interconnection apparatus for establishing electrical contact between two components, said apparatus comprising:

• a plurality of elastic core members, each core member of said plurality of core members having an anchor portion attached to a substrate and a free portion, initially attached to said substrate, which, upon release, extends to a lift height away from said substrate due to an inherent stress gradient in said each core member;
• said each core member having all exposed surfaces enveloped without any discontinuity with one or more electrodeposited coatings, said one or more coatings having a combined thickness greater than that of said core member and balanced internal stresses, wherein lift height variations among said plurality of core members are minimized and wherein a predetermined increase in the spring constant of said core members is provided to lower electrical contact resistance between said two components to within a predetermined range.