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US 7,126,218 B1Granted
Embedded heat spreader ball grid array
AssigneeAmkor Technology, Inc.
InventorsRobert F. Darveaux, Frederick J. G. Hamilton, Bruce M. Guenin, Vincent DiCaprio
Life of this patent
Estimating the term…
Abstract
A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying substrate, and electrical interconnections between the die and the substrate, such as bond wires. The outer portion of the heat spreader substantially cover the outer portion of the substrate, or alternatively, cover only those portions extending in laterally from the sides of the chip and not the corners. An encapsulant completely covers the heat spreader and die.
Claims48
A semiconductor die package, comprising:
- a substrate having a first and a second surface;
- a die having a first surface and a second surface, wherein the first surface of the die is attached to the first surface of the substrate;
- a heat spreader attached to the second surface of the die, wherein the heat spreader comprises:
- an interior planar portion overlying and attached to the die;
- an outer planar portion overlying and attached to at least a portion of the substrate, wherein the outer planar portion overlies substantially all of the substrate;
- and
- a first angled portion extending from the outer planar portion towards the second surface of the die;
- and
- an encapsulant completely enclosing the die and the heat spreader.
6 more elements
A ball grid array (BGA) package, comprising:
- a substrate including a ball grid array;
- a die coupled to the substrate;
- a thin thermal conductive adhesive layer on the die;
- a heat spreader attached to the die with the adhesive layer, wherein the heat spreader comprises:
- an interior planar portion overlying and attached to the die;
- an outer planar portion overlying and attached to at least a portion of the substrate;
- and
- a first angled portion extending from the outer planar portion towards an upper surface of the die;
- and
- an encapsulant completely covering the heat spreader, wherein the heat spreader includes a depressed region opposite a surface of the heat spreader that is attached to an active surface of the die, the depressed region being filled with the encapsulant.
7 more elements
A method of dissipating heat from a ball grid array package, comprising:
- attaching a die to a substrate including a ball grid array;
- attaching a heat spreader directly to the die, wherein the heat spreader comprises:
- an interior planar portion overlying and attached to the die;
- an outer planar portion overlying and attached to at least a portion of the substrate, wherein the outer planar portion overlies substantially all of the substrate;
- and
- a first angled portion extending from the outer planar portion towards an upper surface of the die;
- and
- encapsulating the die and the heat spreader completely.
5 more elements
A method of packaging a semiconductor die, comprising:
- providing a substrate;
- attaching a first surface of the die to the substrate;
- attaching a heat spreader directly to a second surface of the die, the second surface opposing the first surface, wherein the heat spreader comprises:
- an interior planar portion overlying and attached to the die;
- an outer planar portion overlying and attached to at least a portion of the substrate, wherein the outer planar portion overlies substantially all of the substrate;
- and
- a first angled portion extending from the outer planar portion towards the second surface of the die;
- and
- completely covering the heat spreader with an encapsulant.
6 more elements
A semiconductor die package, comprising:
- a substrate having a first and a second surface;
- a die having a first surface and a second surface, wherein the first surface of the die is attached to the first surface of the substrate and the second surface of the die is the face containing active circuitry;
- a heat spreader attached to the second surface of the die, wherein the die has four peripheral sides, and the heat spreader contacts the substrate adjacent each of the four peripheral sides, the heat spreader comprising:
- an interior planar portion overlying and attached to the die;
- an outer planar portion overlying and attached to at least a portion of the substrate;
- and
- a first angled portion extending from the outer planar portion towards the second surface of the die;
- and
- an encapsulant completely enclosing the die and the heat spreader;
- and
- bond wires electrically coupling the second surface of the die to the substrate, wherein the heat spreader superimposes the bond wires.
8 more elements
A semiconductor die package, comprising:
- a substrate having a first and a second surface;
- a die having a first surface and a second surface, wherein the first surface of the die is attached to the first surface of the substrate;
- a heat spreader attached to the second surface of the die, wherein the second surface of the die includes bond pads electrically coupled to the substrate by one of a plurality of bond wires, and the heat spreader contacts the second surface of the die within a perimeter of the bond pads and superimposes the bond wires, and wherein the heat spreader does not contact the substrate, the heat spreader comprising:
- an interior planar portion overlying and attached to the die;
- an outer planar portion overlying and attached to at least a portion of the substrate;
- and
- a first angled portion extending from the outer planar portion towards the second surface of the die;
- and
- an encapsulant completely enclosing the die and the heat spreader.
6 more elements
A semiconductor die package, comprising:
- a substrate having a first and a second surface;
- a die having a first surface and a second surface, wherein the first surface of the die is attached to the first surface of the substrate;
- a heat spreader attached to the second surface of the die, wherein the heat spreader comprises:
- an interior planar portion overlying and attached to the die;
- an outer planar portion overlying and attached to at least a portion of the substrate, wherein the outer planar portion overlies substantially all of the substrate;
- and
- a first angled portion extending from the outer planar portion towards the second surface of the die;
- and
- an encapsulant completely enclosing the die and the heat spreader.
6 more elements
A ball grid array (BGA) package, comprising:
- a substrate including a ball grid array;
- a die coupled to the substrate;
- a thin thermal conductive adhesive layer on the die;
- a heat spreader attached to the die with the adhesive layer, wherein the heat spreader comprises:
- an interior planar portion overlying and attached to the die;
- an outer planar portion overlying and attached to at least a portion of the substrate, wherein the outer planar portion overlies substantially all of the substrate;
- and
- a first angled portion extending from the outer planar portion towards an upper surface of the die;
- and
- an encapsulant completely covering the heat spreader.
7 more elements
Dependencies are inferred from the claim text.