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US 7,126,216 B2Granted
Two part mold for wafer scale caps
AssigneeSilverbrook Research Pty Ltd
InventorKia Silverbrook
Life of this patent
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Abstract
The invention provides a two part mold for forming wafer scale caps. The mold has a first half and a second half. The first half and second half, when brought together defining mold cavities for wafer scale caps. The caps have central areas surrounded by sidewalls and the side walls having free edges. In preferred embodiments, the mold is made from a semiconductor material.
Claims11
A separable mold for forming wafer scale caps, the separable mold comprising:
- a first semiconductor mold element;
- a first release element which is releaseably coupled to the first mold element to form an upper mold section;
- a second semiconductor mold element;
- a second release element which is releasably coupled to the second mold element to form a lower mold section;
- mold cavities being defined by the upper mold section being positioned adjacently to the lower mold section, each cavity having a shape comprising:
- a central cavity areas surrounded by sidewall cavity areas having free edges.
3 more elements
Dependencies are inferred from the claim text.