Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
AssigneeArbor Company LLP
InventorsJon M. Huppenthal, D. James Guzy
Life of this patent
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Abstract
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.
Claims39
A programmable array module comprising:
- at least a first integrated circuit functional element including a field programmable gate array;
- and
- at least a second integrated circuit functional element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit functional element,
- wherein said field programmable gate array is programmable as a processing element, and wherein said memory array is functional to accelerate reconfiguration of said field programmable gate array as a processing element.
A programmable array module comprising:
- at least a first integrated circuit functional element including a field programmable gate array;
- and
- at least a second integrated circuit functional element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit functional element, said first and second integrated circuit functional elements being coupled by a number of contact points distributed throughout the surfaces of said functional elements,
- wherein said field programmable gate array is programmable as a processing element, and wherein said memory array is functional to accelerate reconfiguration of said field programmable gate array as a processing element.
A method of fabricating a programmable array module comprising:
- forming at least a first integrated circuit functional element including a field programmable gate array and a plurality of metal pads on a base wafer;
- forming a first epitaxial layer over the first integrated circuit functional element;
- and
- forming at least a second integrated circuit functional element including a memory array in the first epitaxial layer, the second integrated circuit functional element having a plurality of metal pads, at least one of which is in electrical contact with the metal pads of the first integrated circuit functional element.
A method of fabricating a processor module comprising:
- forming at least a first integrated circuit functional element including a microprocessor on a base wafer;
- and
- using wafer processing techniques, forming at least a second integrated circuit functional element such as a field programmable gate array on the first integrated circuit functional element,
- wherein forming the second integrated circuit functional element comprises forming an epitaxial layer.
A programmable array module comprising:
- at least a first integrated circuit functional element including a field programmable gate array;
- and
- at least a second integrated circuit functional element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit functional element,
- wherein said field programmable gate array is programmable as a processing element, and wherein said memory array is functional to accelerate external memory references to said processing element.
A programmable array module comprising:
- at least a first integrated circuit functional element including a field programmable gate array;
- and
- at least a second integrated circuit functional element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit functional element, said first and second integrated circuit functional elements being coupled by a number of contact points distributed throughout the surfaces of said functional elements,
- wherein said field programmable gate array is programmable as a processing element, and wherein said memory array is functional to accelerate external memory references to said processing element.
A method of fabricating a processor module comprising:
- forming at least a first integrated circuit functional element including a microprocessor on a base wafer;
- using wafer processing techniques, forming at least a second integrated circuit functional element including a field programmable gate array on the first integrated circuit functional element;
- and
- forming a third functional element integrated with the first two functional elements using wafer processing techniques,
- wherein forming the third functional element comprises forming an epitaxial layer.
Dependencies are inferred from the claim text.