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US 7,126,165 B2Granted
Light emitting device assembly
AssigneeSamsung Electronics Co., Ltd.
InventorsJoon-seop Kwak, Jong-wan Kim, Su-hee Chae
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Abstract
Provided is a light emitting device assembly. The light emitting device assembly includes a submount including bumps, each having a bonded surface and a lateral surface surrounding the bonded surface; and a light emitting device including pads, each having a bonded surface corresponding to a bonded surface of a corresponding bump. Herein, edges of the bonded surface of each of the bumps are spaced a predetermined distance inward from edges of a corresponding pad.
Claims8
A light emitting device assembly comprising:
- a submount including bumps, each having a bonded surface and a lateral surface surrounding the bonded surface;
- and
- a light emitting device including pads, each pad having a bonded surface corresponding to a bonded surface of a corresponding bump, said bonded surface of each of said pads including a center portion surrounded by outer edge portions that are defined by projecting portions extending toward the submount:
- wherein outer edge portions of the bonded surface of each of the bumps are offset a predetermined distance inward from corresponding outer edge portions of a corresponding pad sufficient to locate such offset edge portions of the bonded surface out of contact with the projecting portions.
1 more element
Dependencies are inferred from the claim text.