S-parameter power plane probe coupon

A method of providing a test point for a printed circuit board having first and second outer layers, and a power layer and a ground layer disposed between the first and second outer layers, comprising the steps of:

• forming a first conductor connected to the power layer and extending to both the first and second outer layers;
• forming a first conductive pad on the first outer layer such that the first conductive pad is connected to the first conductor;
• forming a second conductive pad on the second outer layer such that the second conductive pad is connected to the first conductor;
• and
• providing at least one connection to the ground layer by:
• forming a second conductor connected to the ground layer and extending to both the first and second outer layers;
• forming a third conductive pad on the first outer layer such that the first conductive pad is connected to the second conductor;
• and
• forming a fourth conductive pad on the second outer layer such that the second conductive pad is connected to the second conductor.