Frame transfer prober
AssigneeTokyo Seimitsu Co., Ltd.
InventorYutaka Ueda
Life of this patent
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Abstract
A frame transfer prober 1, for carrying out an electrical property test on a number of semiconductor chips 10 fixed on a dicing tape 11, comprises a separation detection unit 9 for detecting the separation and/or protrusion of the semiconductor chips 10 from the dicing tape. The separation detection unit has a light emitting portion 91 for emitting a laser beam L, a light receiving portion 92 for receiving the laser beam L so emitted and a determination portion 93 for determining the separation and/or protrusion of the semiconductor chips through an increase or decrease in amount of the laser beam L so received.
Claims5
A frame transfer prober for carrying out an electrical property test on a number of diced semiconductor chips fixed to a dicing tape comprising:
- a separation detection unit for detecting one or more of a separation and protrusion of one or more of the semiconductor chips from the dicing tape in a height direction;
- a stage for holding the dicing tape;
- and
- a stage driving motor for moving the stage in an X axis direction, a Y axis direction, a Z axis direction, and a rotational direction round the Z axis for aligning the stage with the separation detection unit for detecting positions of the semiconductor chips in the X axis direction and the Y axis direction.
Dependencies are inferred from the claim text.