Multi-electron beam exposure method and apparatus
AssigneesHitachi, Ltd., Canon Kabushiki Kaisha, Advantest Corporation
InventorsHaruo Yoda, Yasunari Souda, Hiroya Ohta, Yoshikiyo Yui, Shinichi Hashimoto
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AssigneesHitachi, Ltd., Canon Kabushiki Kaisha, Advantest Corporation
InventorsHaruo Yoda, Yasunari Souda, Hiroya Ohta, Yoshikiyo Yui, Shinichi Hashimoto
Estimating the term…
A multi-electron beam exposure method and apparatus, wherein electron beams are applied to a sample surface mounted on a traveling sample stage to perform repeated exposure of chip patterns. An exposure region of the sample surface is partitioned into multiple stripe regions having a width in an x-axis direction, and each of the multiple stripe regions is further partitioned into multiple main fields having a width in a y-axis direction. At least one of the widths of the main fields in the x- and y-axis directions is set to a value, and exposure pattern data for one chip based on the partitioned main fields is stored as a unit. The stored exposure pattern data is readout a number of times corresponding to the number of chips repeatedly, and each electron beam provides repeated exposure of same regions of the chips.
A multi-electron beam exposure method, wherein electron beams are applied to a sample surface mounted on a traveling sample stage to perform repeated exposure of chip patterns, wherein the method comprises the steps of:
A multi-electron beam exposure apparatus comprising:
Dependencies are inferred from the claim text.