Printed circuit board for avoiding producing cutting burrs
AssigneeLite-On Technology Corporation
InventorYung-Jen Lin
Life of this patent
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Abstract
A printed circuit board for avoiding producing burrs, the printed circuit board includes a packaging substrate, at least one plated through hole, at least one first conductive portion, at least one non-conductive portion, at least one second conductive portion and at least one cut section. The plated through hole is formed on the packaging substrate. The first conductive portion and the second conductive portion respectively are adjacent to two sides of a peripheral of the plated through hole and separated by the non-conductive portion. Furthermore, the cut section is arranged on the non-conductive portion, thus the packaging substrate is cut without passing through the first conductive portion, and it will not cause the burrs on the first conductive portion.
Claims7
A printed circuit board for avoiding producing cutting burrs, comprising:
- an infrared data association chip;
- a packaging substrate packaging the infrared data association chip thereon;
- and
- a plurality of bonding pad units alignedly arranged on the packaging substrate and aligned with one side of the infrared data association chip, each of the bonding pad units comprising:
- a plated through hole formed in the packaging substrate, the plated through hole is plated with a conductive material on an inner wall defining the plated through hole;
- a conductive pad including:
- a first conductive portion arranged on a top surface of the packaging substrate to surround substantially an upper semicircular circumference of the plated through hole, and
- a second conductive portion arranged on the top surface of the packaging substrate to surround substantially a lower portion of a lower semicircular circumference of the plated through hole;
- a non-conductive portion arranged on the packaging substrate, the non-conductive portion being recessed from the top surface of the packaging substrate, the non-conductive portion being along substantially an upper portion of the lower semicircular circumference of the plated through hole, the non-conductive portion traversing two sides of the plated through hole, the non-conductive portion and the second conductive portion surrounding substantially the lower semicircular circumference of the plated through hole;
- and
- a cutting region defined within the non-conductive portion for cutting such that the conductive pad surrounding substantially the upper semicircular circumference of the plated through hole is free of burrs.
Dependencies are inferred from the claim text.