Epoxy molding compounds with resistance to UV light and heat
AssigneeHenkel Corporation
InventorDale Starkey
Life of this patent
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Abstract
A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
Claims5
A method of preparing a molding compound comprising:
- (a) mixing an epoxy composition comprising an epoxy resin and a cyclic anhydride with an antioxidant and a visible light-emitting phosphor material to provide a homogeneous mixture with said phosphor material suspended within said epoxy composition;
- (b) increasing the viscosity of said homogeneous mixture by initiating reaction of the cyclic anhydride with the epoxy resin while maintaining said phosphor material suspended within said epoxy composition to form a pre-reacted intermediate;
- and
- (c) partially curing said epoxy composition of said pre-reacted intermediate, thereby forming said molding compound.
Dependencies are inferred from the claim text.