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US 7,125,788 B2Granted
Circuit device and method of manufacturing the circuit device
AssigneeTDK Corporation
InventorsTakaaki Domon, Toshiyuki Nagatsuka, Tsutomu Yasui, Ryoichi Kondo
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Abstract
A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.
Claims4
A method of manufacturing a circuit device comprising:
- forming a passivation film on a surface of a substrate except on a wiring pattern and an electrode pad pattern that are present on the surface of the substrate, leaving exposed the part of the wiring pattern and the electrode pattern;
- simultaneously forming at least one laminated metallic film only on the wiring pattern where exposed and on the electrode pad pattern where exposed, so that the at least one laminated metallic film is thicker than the passivation film;
- and
- forming a connection bump on the laminated metallic film at the electrode pad portion.
1 more element
Dependencies are inferred from the claim text.