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US 7,125,750 B2Granted
Leadframe with enhanced encapsulation adhesion
AssigneeASM Assembly Materials Ltd.
InventorsYiu Fai Kwan, Wai Chan
Life of this patent
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Abstract
A leadframe having a metallic substrate and comprising layers of plated material, and a method of manufacturing said leadframe are provided. The substrate is plated with a layer of oxidizable material comprising nickel and a noble metal is selectively plated on the layer of oxidizable material. Thereafter, an exposed portion of the oxidizable material that is not plated with the noble metal is passivated to enhance adhesion of an encapsulation compound molded to the leadframe.
Claims19
Method of manufacturing a leadframe having a metallic substrate, comprising the steps of:
- plating the substrate with a layer of oxidizable material comprising nickel,
- selectively plating a noble metal on the layer of oxidizable material to leave a selected exposed portion of the oxidizable material, and thereafter
- passivating the exposed portion of the oxidizable material that is not plated with the noble metal.
A leadframe comprising:
- a metallic substrate,
- a layer of an oxidizable material comprising nickel plated on the substrate, and
- a layer of a noble metal selectively plated on the layer of oxidizable material to leave an exposed portion, wherein an exposed portion of the oxidizable material that is not plated with the noble metal is passivated.
Dependencies are inferred from the claim text.