Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

A method of encapsulating intermediate conductive elements electrically connecting at least one bond pad of a semiconductor die to a corresponding contact area of a carrier substrate, comprising:

• providing a carrier substrate comprising at least one contact area on a surface thereof;
• forming or placing a solder mask having an opening on the surface of the carrier substrate to a thickness in excess of a predicted height of protrusion above the surface of at least one intermediate conductive element to be connected to the at least one contact area;
• aligning the solder mask over at least a portion of the surface of the carrier substrate such that the at least one contact area is exposed through the opening of the solder mask;
• securing a semiconductor die including at least one bond pad to an opposite surface of the carrier substrate with the at least one bond pad exposed through the opening of the solder mask;
• forming or positioning the at least one intermediate conductive element between the at least one bond pad and the at least one contact area;
• positioning a coverlet over the opening of the solder mask to substantially cover the opening of the solder mask while leaving at least one end of the opening of the solder mask open;
• and
• introducing an encapsulant material through the at least one open end of the opening of the solder mask such that the encapsulant material flows into the opening of the solder mask, and to a level at least above the surface of the carrier substrate and at least partially confining the encapsulant material within the opening using the solder mask.