Flip-chip sub-assembly, methods of making same and device including same
AssigneeMiniLogic Device Corporation Ltd.
InventorKwei Chung Li
Life of this patent
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Abstract
An electronic device including a multi-chip die and a substrate member, said multi-chip die includes a plurality of integrated circuit chips which are integrally formed on the multi-chip die as a unitary member, each the integrated chip includes a plurality of electrodes for making external electrical contacts, the substrate member includes a circuit of a pre-determined pattern and a plurality of electric contacts disposed for making corresponding electrical connections with the electrodes of the integrated chips of the multi-chip die, the plurality of integrated circuit chips of the multi-chip die being connected as a unitary member to the substrate member.
Claims6
A method of connecting a plurality of integrated circuit chips to a substrate member, wherein said substrate member includes a pre-determined circuit pattern with a plurality of contact pads, said method includes:
- selecting a plurality of integrated circuit chips from a processed semi-conductor wafer,
- removing said plurality of integrated circuit chips from said wafer as an unitary member,
- aligning the electrodes on said plurality of integrated circuit chips corresponding with said plurality of contact pads on said substrate member,
- electrically connecting said electrodes with said contact pads.
Dependencies are inferred from the claim text.