Method for reduction of electromagnetic interference in integrated circuit packages
AssigneeIntermec IP Corp.
InventorSteven E. Koenck
Life of this patent
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Abstract
EMI radiation in an integrated circuit device package (10) is reduced or eliminated by the introduction of a magnetic material into the encapsulating medium (14). The permeance of the magnetic encapsulating medium (14) affects the inherent series inductance of the lead frame conductors (16) to thereby reduce electromagnetic interference. Ferrite microbeads (30) are formed around the lead frame conductors (16) to contain the magnetic flux (32) generated by an electrical current signal and to attenuate the effects of mutual inductance.
Claims5
The method of reducing electromagnetic interference generated within an integrated circuit device package wherein the integrated circuit device package comprises
- a wafer having wafer circuitry disposed thereon;
- a plurality of conductors defining electrically conductive paths for carrying the electric current flowing to and from the wafer circuitry;
- and
- a structure that encapsulates and supports the wafer, said structure comprises an encapsulating medium;
- said method comprising introducing into the encapsulating medium a powder composed of ferrite magnetic material that exhibits a hysteresis loss, in the vicinity of at least one of the electrically conductive paths such that the ferrite magnetic material does not itself prevent bending of the at least one of the electrically conductive paths, but serves to attenuate the highest frequency signal components while introducing generally little inductance effects of overshoot and ringing associated with the series inductance of the at least one of the electrically conductive paths.
Dependencies are inferred from the claim text.