Solid-state image pickup device and fabrication method thereof
AssigneeSony Corporation
InventorsJunji Yamane, Kunihiko Hikichi
Life of this patent
Estimating the term…
Loading patent…
AssigneeSony Corporation
InventorsJunji Yamane, Kunihiko Hikichi
Estimating the term…
A method of fabricating a solid-state image pickup device comprising forming mask patterns corresponding to patterns of first and third transfer electrodes, which are to be alternately arranged in each vertical transfer register formation region and which are to extend in parallel to each other between light receiving portions adjacent to each other in the vertical direction, on a first electrode material layer. The method also includes forming side walls on each of the mask patterns. The method further includes patterning the first electrode material layer via the mask patterns having the side walls, to form first and third transfer electrodes formed by the first layer. The method yet further includes forming second transfer electrodes by a second electrode material layer via an insulating film in such a manner that each of said second transfer electrodes is disposed between the first and third transfer electrodes of the first layer in said vertical transfer register formation region and between the light receiving portions. The method still further includes forming fourth transfer electrodes by a third electrode material layer via an insulating film in such a manner that each of the fourth transfer electrodes is between the third and first transfer electrodes of the first layer in the vertical transfer register formation region and between the light receiving portions.
A method of fabricating a solid-state image pickup device, comprising the steps of:
A method of fabricating a solid-state image pickup device, comprising the steps of:
Dependencies are inferred from the claim text.