Method for opening the plastic housing of an electronic module
AssigneeATMEL Germany GmbH
InventorsKlaus Burger, Dieter Mutz, Steffen Ziegler
Life of this patent
Estimating the term…
Abstract
In a method of opening of a housing of a plastic-housed electronic module by a laser, the electronic module is protected from the effects of the laser beam and the laser beam is stopped at a suitable time by providing an end point signal detection due to the laser beam impinging on a protective layer. Thereby, after opening the housing, electrical measurements can be carried out on the electronic module.
Claims20
Method for the opening of a plastic-housed electronic module (CH) in a housing (G) of a plastic potting compound produced as a partial or total a potting, with at least one electrical contact surface (K) lying in the potting compound and connection lines extended out of the potting compound, characterized in that
- for exposing the contact surface (K) by means of a laser beam, a portion of the potting compound is removed by the laser beam, and
- an end point signal is produced by the laser beam impinging on a protective layer (SC) lying on the surface of the electronic module, and
- the removal of the potting compound by the laser beam is ended in response to the end point signal, and
- after the removal of the potting compound by the laser beam, the protective layer is removed by etching.
A method of opening a plastic-housed electronic module including an electronic component, a protective layer disposed on at least a portion of said electronic component, and a plastic potting compound forming a housing at least partially around said electronic component, wherein said method comprises the steps:
- a) impinging a laser beam onto said potting compound and thereby vaporizing and removing at least a portion of said potting compound disposed on said electronic component;
- b) carrying out said impinging until said laser beam impinges onto said protective layer;
- c) producing an end point signal in response and due to said laser beam impinging on said protective layer;
- d) ending said impinging by said laser beam in response to said end point signal;
- and
- e) after said step d), removing at least some of said protective layer by etching.
A method of opening a plastic-housed electronic module including an electronic component, a protective layer disposed on at least a portion of said electronic component, and a plastic potting compound forming a housing at least partially around said electronic component, wherein said method comprises the steps:
- a) impinging a laser beam onto said potting compound and thereby emanating a vaporized material by vaporizing and removing at least a portion of said potting compound disposed on said electronic component;
- b) carrying out said impinging until said laser beam impinges onto said protective layer;
- c) during said steps a) and b), using a detector and a computer, detecting and analyzing said vaporized material;
- d) using at least one of said computer or said detector, producing an end point signal in response to a predetermined change of said vaporized material as detected and analyzed in said step c);
- and
- e) ending said impinging by said laser beam in response to said end point signal.
Dependencies are inferred from the claim text.