Back to results
US 7,125,324 B2Granted
Insulated pad conditioner and method of using same
Assignee3M Innovative Properties Company
InventorsGary M. Palmgren, Brian D. Goers, Douglas J. Pysher
Life of this patent
Estimating the term…
Abstract
A wafer planarization process with a conditioning tool having an electrical insulator that electrically insulates the abrasive surface of the conditioning tool. The electrical insulator extends the useful life of the abrasive surface of the conditioning tool by reducing the level of electrochemically driven corrosion.
Claims11
A wafer planarization system comprising:
- an electrical source having a first electrode and a second electrode;
- a polishing pad carrier connected to said first electrode;
- a workpiece carrier connected to said second electrode;
- a conditioning tool comprising an abrasive surface adapted to condition said polishing pad;
- and
- an electrical insulator configured to isolate said abrasive surface from at least one of said first electrode and said second electrode;
- wherein said conditioning tool comprises said electrical insulator;
- wherein said conditioning tool further comprises an electrically insulated conditioning disk comprising said abrasive surface and a substrate proximate said abrasive surface;
- and wherein said conditioning disk further comprises a carrier affixed to said substrate.
6 more elements
A method of conditioning an electrochemical-mechanical polishing pad comprising:
- electrically insulating an abrasive surface of a conditioning tool;
- wherein said conditioning tool comprises an electrically insulated conditioning disk comprising a substrate proximate said abrasive surface and a carrier affixed to said substrate;
- contacting said abrasive surface with said polishing pad;
- and
- moving said abrasive surface relative to said polishing pad.
2 more elements
Dependencies are inferred from the claim text.