Method of bonding seal caps to a substrate of organic electroluminescent elements
AssigneeRohm Co., Ltd.
InventorMakoto Takamura
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Abstract
A method of manufacturing an organic electroluminescent display element includes the steps of forming a plurality of organic electroluminescent elements on top of a transparent substrate, bonding seal caps provided with electronic circuits to the transparent substrate so as to seal each of the organic electroluminescent elements, and then cutting the transparent substrate around each of the organic electroluminescent elements to form organic electroluminescent display elements.
Claims3
A method of manufacturing an organic electroluminescent display element, comprising the steps of:
- forming a plurality of organic electroluminescent elements on top of a transparent substrate;
- bonding seal caps made of glass which is transparent to ultraviolet light over the top of an electronic circuit arranged on top of said transparent substrate so as to seal each of said electroluminescent elements;
- and
- then cutting said transparent substrate around each of said organic electroluminescent elements to form organic electroluminescent display elements wherein an ultraviolet curing resin seal is used in the bonding of said seal caps to said top of said transparent substrate and the bonding of said seal caps to said transparent substrate is carried out by shining ultraviolet light on the ultraviolet curing resin seal from said seal caps side.
A method of manufacturing an organic electroluminescent display element, comprising the steps of:
- forming a plurality of organic electroluminescent elements on top of a transparent substrate;
- bonding seal caps provided with electronic circuits to said transparent substrate so as to seal each of said electroluminescent elements;
- and then
- cutting said transparent substrate around each of said organic electroluminescent elements to form organic electroluminescent display elements, wherein an ultraviolet curing resin seal having anisotropic conductive particles mixed therein is used in the bonding of said seal caps to said transparent substrate, and ultraviolet light is shone on said ultraviolet curing resin seal after said seal caps and said transparent substrate are compressed so that anisotropic conductive particles have a compressibility of 10˜50%.
Dependencies are inferred from the claim text.