IC socket
AssigneeTyco Electronics AMP GmbH
InventorShinichi Hashimoto
Life of this patent
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Abstract
An IC socket that is capable of obtaining stable, reliable electrical connections between an IC package and a socket housing, even in the case that the IC package is placed at a position shifted from a predetermined position on the socket housing then pressed, during connection of the IC package, without grinding down the peripheral wall of a mounting surface, onto which the IC package is mounted. Metal plates, for guiding the IC package, are provided on at least a portion of the peripheral wall that surrounds the mounting surface of the socket housing. The metal plates are of a shape such that they are coplanar with or protrude upward from an upper surface of the peripheral wall, and such that they are coplanar with or protrude inward from an inner surface of the peripheral wall.
Claims9
An IC socket, comprising:
- a plurality of electrical contacts;
- an insulative socket housing for holding the electrical contacts arranged substantially in a matrix;
- and
- a cover member for pressing an IC package, which is placed on a mounting surface surrounded by a peripheral wall of the socket housing, against the electrical contacts, and for holding the IC package between the cover member and the socket housing in the pressed state;
- wherein
- a metal plate for guiding the IC package onto the mounting surface is provided at least a portion of the peripheral wall;
- and
- the metal plate is of a shape such that it is coplanar with or protrudes upward from the upper surface of the peripheral wall and such that it is coplanar with or protrudes inwardly from the inner surface of the peripheral wall.
Dependencies are inferred from the claim text.