PCB with embedded optical fiber

High speed data interconnect apparatus comprising:

• a stiffening plate with an elongated optical fiber mounting groove defined on a surface thereof, wherein the stiffening plate has a coefficient of thermal expansion approximately matching a coefficient of thermal expansion of the optical fiber for reducing relative movement between the stiffening plate and the optical fiber and substantially eliminating stress in the optical fiber;
• a length of optical fiber with first and second opposed ends and defining an optical path between the opposed ends, the optical fiber being mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate;
• a first reflecting surface positioned adjacent the first opposed end of the optical fiber, the first reflecting surface being positioned to direct light at an angle of approximately ninety degrees to the optical path and a second reflecting surface positioned adjacent the second opposed end of the optical fiber, the second reflecting surface being positioned to direct light at an angle of approximately ninety degrees to the optical path;
• a printed circuit board laminate encasing the stiffening plate and the optical fiber and including a first light via for the passage of light reflected by the first reflecting surface and a second light via for the passage of light reflected by the second reflecting surface, and first bond pads formed on a surface of the printed circuit board laminate adjacent the first light via and second bond pads formed on a surface of the printed circuit board laminate adjacent the second light via;
• a vertical cavity surface emitting laser mounted on the surface of the printed circuit board laminate in light communication with the first light via, using the first bond pads formed adjacent the first light via;
• and
• a photo detector mounted on the surface of the printed circuit board laminate in light communication with the second light via, using the second bond pads formed adjacent the second light via.

High speed data interconnect apparatus comprising:

• a stiffening plate with an elongated optical fiber mounting groove defined on a surface thereof, the stiffening plate has a coefficient of thermal expansion approximately matching a coefficient of thermal expansion of the optical fiber for reducing relative movement between the stiffening plate and the optical fiber and substantially eliminate stress in the optical fiber;
• a length of optical fiber with first and second opposed ends and defining an optical path between the opposed ends, the optical fiber being mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate;
• a printed circuit board laminate encasing the stiffening plate and the optical fiber and including a first via through the laminate and a second via through the laminate, and at least first bond pads formed on a surface of the printed circuit board laminate adjacent the first light via, and the stiffening plate has a Modulus of Elasticity higher than a Modulus of Elasticity of the laminate for constraining movement of the surface of the laminate and the first bond pads mounted thereon relative to the stiffening plate and the optical fiber;
• and
• an optical element electrically coupled to the first bond pads and positioned adjacent the first via in optical alignment with the first end of the length of optical fiber, wherein the optical element is mounted on the first bond pads so as to be positioned adjacent the first via in optical alignment with the first end of the length of optical fiber.