Back to results
US 7,124,931 B2Granted
Via heat sink material
AssigneeIntel Corporation
InventorsJ. Shelton Lewis, Shawn Lloyd, Michael Kochanowski, John Oldendorf
Life of this patent
Estimating the term…
Abstract
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
Claims5
A method, comprising:
- applying thermally conductive material to a first side of a layer, the layer having a connection pad on the first side of the layer, a via extending from the first side to a second side of the layer and being coated with an electrically conductive material where the thermally conductive material and the electrically conductive material are different, and a conductive trace between the via and the connection pad on the first side of the layer, the thermally conductive material being applied to be in contact with at least one of the via and the conductive trace;
- connecting a first component to the connection pad with a first connection material having a melting point;
- and
- connecting, after connecting the first component, a second component to a second side of the layer after connecting the first component to the connection pad, wherein the second component is connected to the second side with a second connection material raised to a temperature at least as high as the melting point of the first connection material.
1 more element
Dependencies are inferred from the claim text.