Flip chip bonding tool and ball placement capillary
OwnerSteven F. Reiberinventor
Life of this patent
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Abstract
A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow to the device being bonded is disclosed.
Claims17
A flip chip bonding tool and ball placement capillary system for connecting leads on integrated circuit bonding pads, comprising a dissipative material having a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to stop current flow large enough to damage the device being bonded.
An ESD-preventive device comprising:
- a flip chip bonding tool and ball placement capillary, comprising a dissipative material and configured to come in contact with a device being bonded, wherein a current produced by static charge generated during bonding is allowed to flow;
- wherein the dissipative material has a resistance low enough to prevent a discharge of charge to the device being bonded and high enough to stop all current flow to the device being bonded.
A method of utilizing a flip chip bonding tool and ball placement capillary in a microelectronic assembly, comprising:
- providing a bonding machine capable of being equipped with a flip chip bonding tool and ball placement capillary having a tip comprised of a dissipative material, the dissipative material having a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to stop all current flow to the device being bonded;
- equipping the bonding machine with the flip chip bonding tool and ball placement capillary;
- providing a bonding material that is thermally and electrically conductive;
- melting the bonding material so that the bonding material becomes substantially spherical in shape;
- and
- electrically connecting at least one component to a substrate by means of pressing the substantially spherical-shaped bonding material, the substantially spherical bonding material being pressed to form a conductive bump.
Dependencies are inferred from the claim text.