Method for forming multilayer circuit board

A method for forming a connection within a multi-layer circuit board, said multi-layer circuit board including a first pre-circuit assembly including a conductive core member, a dielectric member which is attached to a top surface of said conductive core member, and a second pre-circuit assembly including a second core member and a first and second conductive member which are respectively attached to a top and bottom surface of said second core member, said method comprising the steps of:

• selectively forming at least one hole through said first pre-circuit assembly in a location where a connection to said conductive core member is desired to be formed;
• registering said second pre-circuit assembly with respect to said first pre-circuit, effective to cause a portion of said second conductive member to reside above said at least one hole;
• attaching said second pre-circuit assembly to said dielectric member;
• selectively inserting a conductive material within said at least one hole, effective to connect said portion of said second conductive member to said conductive core member;
• selectively removing areas of said second pre-circuit assembly which are disposed above said first portion of the second conductive member of said second pre-circuit assembly, thereby exposing said first portion of said second conductive member;
• and
• deforming said first portion of said second conductive member, effective to cause said first portion of said second pre-circuit assembly to extend within said hole.