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US 7,122,126 B1Granted
Wet processing using a fluid meniscus, apparatus and method
AssigneeMaterials Technologies Corporation
InventorRicardo I. Fuentes
Life of this patent
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Abstract
A wet processing apparatus and method that takes advantage of a fluid meniscus to process at least a portion of a surface of an object. After one surface of the object has been processed another side or surface of the object can be similarly processed. This processing can be coating, etching, plating, to name a few. An application of the apparatus and method is in the semiconductor processing industry, especially, the processing of wafers and substrates. The method and apparatus also allows the processing of multiple surfaces of an electronic component.
Claims28
A fluid meniscus process, comprising the steps of:
- (a) holding at least a portion of a first surface of an object with a holding fixture, such that at least a portion of a second surface of the object is exposed;
- (b) injecting at least one fluid in a tank such that a fluid meniscus is formed;
- (c) contacting at least a portion of the second surface of the object with at least a portion of the fluid meniscus;
- (d) moving the object and the tank in two or more consecutive lateral directions relative to each other, the meniscus being in contact with the object during each one of the two or more consecutive lateral direction movements so as to generate consecutive uniform stripes;
- and
- (e) removing the object after at least one contact with the fluid meniscus.
3 more elements
Dependencies are inferred from the claim text.