High frequency module and radio device using the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsYoshikuni Fujihashi, Hiroki Iwamiya, Yuji Osumi
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Abstract
The high-frequency module of the present invention is formed of two sections: first high-frequency circuit 5 having a first filter circuit; and second high-frequency circuit 6 having a second filter circuit. At least any one of the two high-frequency circuits has a conductive case. The structure is highly effective in attenuating a spurious signal, thereby solving the problem that the output level of the spurious signal fed from the high-frequency module is undesirably increased.
Claims8
A high-frequency module comprising:
- a) a first circuit board having a first high-frequency circuit thereon, the first high-frequency circuit including:
- a-1) a mixing circuit for mixing a base band signal fed from a base band section with a local signal fed from an oscillator;
- and
- a-2) a first filter circuit for attenuating a local leak from the mixing circuit;
- and
- b) a second circuit board having a second high-frequency circuit thereon, the second high-frequency circuit containing a second filter circuit for attenuating a local leak from the first filter circuit;
- c) a motherboard having the first circuit board and the second circuit board formed on the same face thereon,
- wherein both the first circuit board and the second circuit board are covered with a conductive case.
A wireless device employing a high-frequency module, the high-frequency module comprising:
- a) a first circuit board having a first high-frequency circuit thereon, the first high-frequency circuit further including:
- a-1) a mixing circuit for mixing a base band signal fed from a base band section with a local signal fed from an oscillator;
- and
- a-2) a first filter circuit for attenuating a local leak from the mixing circuit;
- and
- b) a second circuit board having a second high-frequency circuit thereon, the second high-frequency circuit containing a second filter circuit for attenuating a local leak from the first filter circuit;
- c) a motherboard having the first circuit board and the second circuit board formed on the same face thereon,
- wherein both of the first circuit board and the second circuit board are covered with a conductive case.
Dependencies are inferred from the claim text.