Scalable, modular, strictly non-blocking electro-optical cross connect core

An OXC core in telecommunications, comprising:

• electronic and/or optical switch elements as building blocks of three stage interconnection matrix architecture according to Clos configuration,
• an interconnecting backplane for mounting said switch elements,
• the architecture of said core being carried out with removable switching elements, wherein
• the three switching matrices of a single line of the Clos configuration belong to single removable active boards, and
• interconnections between said switch elements of the active boards are obtained by passive boards being fitted into said interconnecting backplane provided for the maximum sizing of the core.

An electro-optical cross connect core for use in telecommunications, comprising:

• cross-connect core ports;
• electronic and/or optical switch matrices interconnected in a three stage Clos architecture including an input switching matrix, a middle switching matrix, and an output switching matrix to achieve a strictly non-blocking condition for the electro-optical cross connect core;
• a backplane;
• and
• wherein the electro-optical cross connect core includes a scalable architecture having removable modular boards including one or more active boards and one or more passive boards,
• wherein the first, second, and third switching matrices of all three stages in a line of the Clos architecture are provided on each active board, with the passive boards lacking any of the switching matrices, and
• wherein the backplane interconnects active and passive boards inserted into the backplane.

An OXC core for use in telecommunications, comprising:

• electronic and/or optical switch elements as building blocks of a three stage interconnection matrix architecture according to a Clos configuration, and
• an interconnecting backplane,
• wherein the three stage switch elements of a single line of the Clos configuration are included in a single removable active board, and
• wherein interconnections between the switch elements of the active board inserted into the interconnecting backplane are made via passive boards inserted into the interconnecting backplane.