Accuracy analyzing apparatus for machine tool
AssigneesMori Seiki Co., Ltd., Intelligent Manufacturing Systems International
InventorMakoto Fujishima
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AssigneesMori Seiki Co., Ltd., Intelligent Manufacturing Systems International
InventorMakoto Fujishima
Estimating the term…
The present invention relates to an accuracy analyzing apparatus which is capable of efficiently analyzing accuracies of a machine tool including the perpendicularity of a spindle axis and the thermal displacement of a spindle with a higher level of accuracy at lower costs. The accuracy analyzing apparatus (1) comprises a laser oscillator (2) attached to the spindle (26) for emitting a laser beam having a light axis perpendicular to the spindle axis, an imaging device (5, 8) having a light receiving section (5) disposed in the vicinity of the laser oscillator (2) for receiving the laser beam from the laser oscillator (2) by the light receiving section (5) and generating two-dimensional image data, and an analyzer (15) for analyzing the accuracies of the machine tool (20) on the basis of the generated image data.
An accuracy analyzing apparatus for a machine tool comprising a table, a spindle and a feed mechanism for relatively moving the table and the spindle along orthogonal three axes including a first axis extending along a spindle axis and second and third axes perpendicular to each other and perpendicular to the first axis, the accuracy analyzing apparatus comprising:
Dependencies are inferred from the claim text.