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US 7,120,178 B2Granted
Chip carrier apparatus and method
AssigneeIntel Corporation
InventorsWilliam J. Kozlovsky, Andrew Daiber, Kevin Sawyer
Life of this patent
Estimating the term…
Abstract
A chip carrier having improver thermal properties, wherein the chip carrier may be formed having waist section, and a first transverse end portion joined to the waist section. A first surface of the carrier being configured to receive a chip thereon, and a second surface of the carrier configured to be coupled to a thermal control unit to provide cooling of the carrier and chip. The chip carrier may have a second transverse end portion joined to the waist portion in certain embodiments.
Claims17
An apparatus, comprising:
- a chip carrier having a Dog-Bone shape formed by:
- a waist section, a transverse end portion on one end of the waist section, a second transverse end portion on a second end of said waist section, a top surface to support a chip, a bottom surface to be coupled to a thermal control element;
- a first arcuate portion on a first side of said waist section;
- and
- a second arcuate portion on a second side of said waist section,
- wherein said chip comprises a laser diode chip,
- wherein said laser diode chip comprises a bent waveguide diode emitter, and
- wherein the first arcuate portion is to accommodate a first collimator.
5 more elements
A laser apparatus, comprising:
- a chip;
- a carrier for said chip, said carrier having a Dog-Bone shape formed by a waist section, a first transverse end portion on one end of said waist section, a second transverse end portion on a second end of said waist section, a first arcuate portion on a first side of said waist section, and a second arcuate portion on a second side of said waist section, a first surface to support a gain medium, and a second surface to couple to a thermal control element;
- and
- a first collimator located adjacent a first side of said waist section, the first collimator to collimate a first light beam emitted from a first output facet of said chip.
1 more element
A method of laser operation, comprising:
- emitting a beam from a facet of a gain medium chip, said gain medium chip being mounted on a first surface of a chip carrier, said chip carrier having a Dog-Bone shape formed by a waist section, a first transverse end portion on one end of said waist section, a second transverse end portion on a second end of said waist section, a first arcuate portion on a first side of said waist section, and a second arcuate portion on a second side of said waist section, said chip carrier comprising thermally conductive material;
- and
- collimating the beam using a collimator positioned adjacent a first side of said waist section.
Dependencies are inferred from the claim text.