Back to results
US 7,120,069 B2Granted
Electronic circuit package
AssigneeHitachi, Ltd.
InventorsNobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka, Tetsuya Okishima
Life of this patent
Estimating the term…
Abstract
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
Claims84
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided exclusively on one side of said substrate and second data lines provided exclusively on another side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided exclusively on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided exclusively on said another side of said substrate.
2 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided exclusively on one side of said substrate and second data lines provided exclusively on another side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided exclusively on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided exclusively on said another side of said substrate,
- wherein said first data lines correspond to a portion of a plurality of bits of a data signal formed by a portion of said data lines and said second data lines correspond to another portion of the bits of the data signal formed by another portion of said data lines.
3 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided exclusively on one side of said substrate and second data lines provided exclusively on another side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided exclusively on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided exclusively on said another side of said substrate,
- wherein said first data lines corresponding to upper bits of said data lines and said second data lines corresponding to lower bits of said data lines.
3 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided on one side of said substrate but not on another side of substrate and second data lines provided on said another side of said substrate but not on said one side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided on said one side of said substrate ;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided on said another side of said substrate.
2 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided on one side of said substrate but not on another side of substrate and second data lines provided on said another side of said substrate but not on said one side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided on said another side of said substrate,
- wherein said first data lines correspond to a portion of a plurality of bits of a data signal formed by a portion of said data lines and said second data lines correspond to another portion of the bits of the data signal formed by another portion of said data lines.
3 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided on one side of said substrate but not on another side of substrate and second data lines provided on said another side of said substrate but not on said one side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided on said another side of said substrate,
- wherein said first data lines corresponding to upper bits of said data lines and said second data lines corresponding to lower bits of said data lines.
3 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided exclusively on one side of said substrate and second data lines provided exclusively on another side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided exclusively on said one side of said substrate ;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided exclusively on said another side of said substrate,
- wherein connection is made to said first data lines exclusively on said one side and connection is made to said second data lines exclusively on said another side.
3 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided exclusively on one side of said substrate and second data lines provided exclusively on another side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided exclusively on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided exclusively on said another side of said substrate,
- wherein said first data lines correspond to a portion of a plurality of bits of a data signal formed by a portion of said data lines and said second data lines correspond to another portion of the bits of the data signal formed by another portion of said data lines, and
- wherein connection is made to said first data lines exclusively on said one side and connection is made to said second data lines exclusively on said another side.
4 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided exclusively on one side of said substrate and second data lines provided exclusively on another side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided exclusively on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided exclusively on said another side of said substrate,
- wherein said first data lines corresponding to upper bits of said data lines and said second data lines corresponding to lower bits of said data lines, and
- wherein connection is made to said first data lines exclusively on said one side and connection is made to said second data lines exclusively on said another side.
4 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided on one side of said substrate but not on another side of substrate and second data lines provided on said another side of said substrate but not on said one side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided on said another side of said substrate,
- wherein connection is made to said first data lines on said one side of said substrate but not on another side of substrate and connection is made to said second data lines on said another side of said substrate but not on said one side of said substrate.
3 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided on one side of said substrate but not on another side of substrate and second data lines provided on said another side of said substrate but not on said one side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided on said another side of said substrate,
- wherein said first data lines correspond to a portion of a plurality of bits of a data signal formed by a portion of said data lines and said second data lines correspond to another portion of the bits of the data signal formed by another portion of said data lines, and
- wherein connection is made to said first data lines on said one side of said substrate but not on another side of substrate and connection is made to said second data lines on said another side of said substrate but not on said one side of said substrate.
4 more elements
A semiconductor multi-chip module, comprising:
- a substrate;
- a plurality of data lines including first data lines provided on one side of said substrate but not on another side of substrate and second data lines provided on said another side of said substrate but not on said one side of said substrate;
- a first group of semiconductor chips mounted on said one side of said substrate, said first group of semiconductor chips being connected to said first data lines provided on said one side of said substrate;
- and
- a second group of semiconductor chips mounted on said another side of said substrate, said second group of semiconductor chips being connected to said second data lines provided on said another side of said substrate,
- wherein said first data lines corresponding to upper bits of said data lines and said second data lines corresponding to lower bits of said data lines, and
- wherein connection is made to said first data lines on said one side of said substrate but not on another side of substrate and connection is made to said second data lines on said another side of said substrate but not on said one side of said substrate.
4 more elements
Dependencies are inferred from the claim text.