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US 7,120,033 B2Granted
Electrically conducting bonding connection
AssigneeSiemens Aktiengesellschaft
InventorsKurt Gross, Hans Rappl
Life of this patent
Estimating the term…
Abstract
An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).
Claims11
A heat sink comprising:
- an electrically conducting bonding connection between an electronic circuit, arranged on said heat sink, and an electrically conducting support plate, the plate acting as a heat sink,
- the support plate having a hole, the hole formed at the point of the support plate at which the bonding connection is to be produced,
- an electrically conducting bonding element with a bondable surface being pressed into said hole, wherein the support plate and the bonding element enter into an electrically conducting and frictional connection, and whereby subsequently the bonding connection is produced.
Dependencies are inferred from the claim text.