Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors

A data processing system comprising:

• a bus coupling components in the data processing system;
• a display coupled to the bus;
• external memory coupled to the bus;
• and
• a processor coupled to the bus and comprising an electronic assembly including:
• a die comprising first and second power supply nodes and a first signal node;
• and
• a multilayer substrate comprising:
• a ceramic portion comprising a second signal node and at least one embedded capacitor having a first terminal and a second terminal;
• and
• an organic portion comprising a plurality of conductors, including a first conductor coupling the first power supply node to the first terminal, a second conductor coupling the second power supply node to the second terminal, and a third conductor coupling the first signal node to the second signal node.