US 7,120,029 B2Granted

IC card and method of manufacturing the same

AssigneesRenesas Technology Corp., Hitachi ULSI Systems Co., Ltd.

InventorsHirotaka Nishizawa, Kenji Osawa, Akira Higuchi, Junichiro Osako, Tamaki Wada

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Abstract

The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.

Claims26

Dependent claims

An IC card comprising:

(a) a wiring substrate having a front surface and a rear surface;
(b) external connecting terminals arranged over the rear surface of the wiring substrate;
(c) a first flash memory chip and a controller chip for the first flash memory chip arranged over the front surface of the wiring substrate and connected electrically to the external connecting terminals through wirings of the wiring substrate;
(d) a resin covering the first flash memory chip and the controller chip;
and
(e) a case which covers the resin in such a manner that the external connecting terminals are exposed,
wherein the case has a first end side near which the external connecting terminals are arranged and a second end side positioned on an opposite side to the first end side,
wherein a planar outline of the wiring substrate is smaller than half of a planar outline of the case,
wherein the wiring substrate is entirely disposed in an area of the case closer to the first end side with respect to a middle position between the first and the second end sides, and
wherein the case comprises a first case member and a second case member.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/668,187Filed 24 Sep 2003
Priority: JP 2002-28567930 Sep 2002
Published: US 2004/0062112 A11 Apr 2004
Granted: 10 Oct 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

G06K 19/07743
Constructional details, e.g. mounting of circuits in the carrier: external electrical contacts
H10W 72/0198
Manufacture or treatment: batch processes
H10W 72/5522
Comprising metals or metalloids, e.g. silver: comprising gold [Au]
H10W 90/754
Of bond wires: between a chip and a stacked insulating package substrate, interposer or RDL