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US 7,120,018 B2Granted
Mother board with a ventilation-enhancing member
AssigneeASUSTeK COMPUTER INC.
InventorsChen-Lai Shen, Chuan-Te Chang
Life of this patent
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Abstract
A mother board includes a CPU, a suction fan mounted on the CPU for dissipating heat resulting from operation of the CPU, a north bridge chip disposed downstream to the suction fan, a power-consumption component disposed at one side of the CPU, and a ventilation-enhancing member disposed above the chip and capable of diverting an air flow of the suction fan toward the power-consumption component.
Claims17
A mother board comprising:
- a central processing unit;
- a fan mounted on said central processing unit for dissipating heat generated by operation of said central processing unit;
- a power-consumption component disposed nearby said central processing unit and electrically connected to said central processing unit;
- and
- a ventilation-enhancing member including a blocking portion and a guiding portion, wherein said blocking portion is disposed downstream of and extending transversely to an air flow direction of said fan, said guiding portion extending from said blocking portion toward said power-consumption component, whereby the air flow resulting from operation of said fan is diverted to said power-consumption component,
- wherein said central processing unit and said power-consumption component are located at the same side of the blocking portion, and said ventilation-enhancing member reverses the airflow passing from said central processing unit towards the power-consumption component.
3 more elements
A mother board comprising:
- a central processing unit;
- a fan mounted on said central processing unit for dissipating heat generated due to operation of said central processing unit;
- a chip set electrically connected to said central processing unit, disposed downstream to flow direction of said fan;
- a first heat sink disposed between said fan and said central processing unit to enhance dissipating effects of said central processing unit, said first heat sink having a plurality of fins so as to guide an air flow from said fan toward said chip set;
- a second heat sink mounted above said chip set to enhance dissipating effects of said chip set;
- a power-consumption component disposed nearby and electrically connected to said central processing unit offset from the air flow direction of said fan;
- and
- a ventilation-enhancing member mounted on said second heat sink in such a manner to divert the airflow of said fan toward said power-consumption component,
- wherein said central processing unit and said power-consumption component are located at the same side of the ventilation-enhancing member, and the airflow generated by said fan passing from said central processing unit, via said chip set, to said power-consumption component.
6 more elements
Dependencies are inferred from the claim text.