Apparatus and method for constructing and packaging printed antenna devices
AssigneeInternational Business Machines Corporation
InventorsBrian Paul Gaucher, Duixian Liu, Ullrich Richard Rudolf Pfeiffer, Thomas Martin Zwick
Life of this patent
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Abstract
Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.
Claims12
An IC (integrated circuit) package device, comprising:
- a package substrate having a ground plane formed on a surface thereof;
- an IC chip bonded to the surface of the package substrate;
- a planar substrate comprising an antenna pattern formed on a first surface of the planar substrate, wherein the planar substrate is flip-chip bonded to the IC chip such that the antenna pattern faces toward the ground plane of the package substrate and the first surface of the planar substrate is disposed substantially parallel to, and displaced from, the ground plane of the package substrate;
- and
- a package cover formed over the package base substrate to encapsulate the IC chip and planar substrate, wherein the package cover comprises an opening that exposes a portion of a second surface of the planar substrate opposite a portion of the first surface of the planar substrate having the antenna pattern.
Dependencies are inferred from the claim text.