Electronic tampering detection system

A system for detecting tampering or unauthorized entry into a package formed from a blank having at least a pair of closure tabs, an inner surface and an outer surface, said system comprising:

• electrically conducting adhesive applied to each of said closure tabs;
• a programmable chip applied to one of said surfaces, said chip including a power source, procedure memory, data memory, clock means, an analog to digital converter (ADC), and communication means;
• and
• a grid of low resistance electrically conducting trace means applied to one surface of the blank, and high resistance electrically conductive trace means connecting said chip to said grid at two separate points thereon;
• whereby with said blank having been formed into a closed package through adhesive joining together of said closure tabs, any separation of said tabs or penetration of said package will break an electrical circuit which includes said trace means, said electrically conducting adhesive, and said chip means, which break will be recorded as a change in system resistance with a time stamp in said data memory of said chip.

A system for detecting tampering or unauthorized entry into a package formed from a blank having at least a pair of closure tabs, an inner surface and an outer surface, said system comprising:

• electrically conducting adhesive applied to each of said closure tabs;
• a programmable chip applied to one of said surfaces, said chip including a power source, procedure memory, data memory, clock means, an analog to digital converter (ADC), and communication means;
• a coating of low resistance electrically conducting trace means applied to one surface of the blank to cover such surface;
• and high resistance electrically conductive trace means connecting said chip to said coating at two separate points thereon;
• whereby with said blank having been formed into a closed package through adhesive joining together of said closure tabs, any separation of said tabs or penetration of said package will alter an electrical circuit which includes said trace means, said coating, said electrically conducting adhesive, and said chip means, which separation or penetration will be recorded as a change in system resistance with a time stamp in said data memory of said chip.