Rotation-magnetron-in-magnetron (RMIM) electrode, method of manufacturing the RMIM electrode, and sputtering apparatus including the RMIM electrode
AssigneeSamsung Electronics Co., Ltd.
InventorsJai-kwang Shin, Seong-gu Kim, Young-kyou Park, Hyeon-ill Um
Life of this patent
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Abstract
An RMIM electrode, a method for manufacturing the RMIM electrode, and a sputtering apparatus using the RMIM electrode, wherein the RMIM electrode includes a magnet unit including a cylinder-shaped magnet located at a center of the magnet unit and a plurality of ring-shaped magnets having increasingly larger diameters surrounding the cylinder-shaped magnet; and a driver unit for supporting and for off-axis-rotating the magnet unit, wherein in the magnet unit, adjacent magnets have opposite magnetization directions.
Claims18
A rotation magnetron-in-magnetron (RMIM) electrode comprising:
- a magnet unit including a cylinder-shaped magnet located at a center of the magnet unit and at least two ring-shaped magnets surrounding the cylinder-shaped magnet, each of the cylinder-shaped magnet and the at least two ring-shaped magnets having a center at a location that is different from a location of a center of any other magnet;
- and
- a driver unit for supporting and for off-axis-rotating the magnet unit,
- wherein in the magnet unit, adjacent magnets have opposite magnetization directions.
A sputtering apparatus comprising:
- a first electron unit on which a wafer is mounted;
- a second electron unit under which a target formed of a predetermined material to be deposited on the wafer is provided;
- a magnet unit placed behind the second electrode unit, the magnet unit including a cylinder-shaped magnet placed at a center of the magnet unit and at least one ring-shaped magnet surrounding the cylinder-shaped magnet, each at least one ring-shaped magnet having an asymmetric shape;
- and
- a driver unit for supporting and for off-axis-rotating the magnet unit,
- wherein in the magnet unit, adjacent magnets have opposite magnetization directions.
A rotation magnetron-in-magnetron (RMIM) electrode comprising:
- a magnet unit including a cylinder-shaped magnet located at a center of the magnet unit and at least one ring-shaped magnet surrounding the cylinder-shaped magnet, each at least one ring-shaped magnet having an asymmetric shape;
- and
- a driver unit for supporting and for off-axis-rotating the magnet unit,
- wherein in the magnet unit, adjacent magnets have opposite magnetization directions.
A sputtering apparatus comprising:
- a first electron unit on which a wafer is mounted;
- a second electron unit under which a target formed of a predetermined material to be deposited on the wafer is provided;
- a magnet unit placed behind the second electrode unit, the magnet unit including a cylinder-shaped magnet placed at a center of the magnet unit and at least two ring-shaped magnets surrounding the cylinder-shaped magnet, each of the cylinder-shaped magnet and the at least two ring-shaped magnets having a center at a location that is different from a location of a center of any other magnet;
- and
- a driver unit for supporting and for off-axis-rotating the magnet unit,
- wherein in the magnet unit, adjacent magnets have opposite magnetization directions.
Dependencies are inferred from the claim text.