Main power inductance based on bond wires for a switching power converter
AssigneeNational Semiconductor Corporation
InventorFrank J. de Stasi
Life of this patent
Estimating the term…
Abstract
A method for providing main power inductance to a switching power supply using bond wires of an integrated circuit packaging. A predetermined number of bond wires are connected serially between standalone die bond pads and no-connect pins of the packaging. An output of the switching power supply is connected to a first bond wire, and an output pin of the integrated circuit is connected to a last bond wire. A number of the bond wires, a length and a diameter of each bond wire, and a distance of the bond wires from a die attach paddle may be pre-selected to determined the main power inductance.
Claims17
An inductor for an integrated circuit, comprising a first inductive element, wherein the first inductive element comprises:
- a first die bond pad and a second die bond pad;
- a first package pin and a second package pin;
- a first bond wire that is coupled between the first die bond pad and the first package pin;
- a second bond wire that is coupled between the first package pin and the second die bond pad;
- and
- a third bond wire that is coupled between the second die bond pad and the second package pin, wherein an output of a circuit included in the integrated circuit is coupled to the first die bond pad.
An integrated power supply circuit on a chip, comprising:
- a first inductive element;
- and
- a power regulator subcircuit that is arranged to provide an output to the first inductive element on the chip, wherein the first inductive element comprises:
- a first die bond pad and a second die bond pad;
- a first package pin and a second package pin;
- a first bond wire that is coupled between the first die bond pad and the first package pin;
- a second bond wire that is coupled between the first package pin and the second die bond pad;
- and
- a third bond wire that is coupled between the second die bond pad and the second package pin, wherein the output of the power regulator subcircuit is coupled to the first die bond pad, and wherein the second package pin of the first inductive element is arranged to provide an output of the integrated power supply circuit.
Dependencies are inferred from the claim text.