Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board

An integrated type electronic component comprising:

• a semiconductor device having a semiconductor chip, first electrodes connected to the semiconductor chip, a stress relieving structure provided on the semiconductor chip, and an interconnecting line electrically connected to one of the first electrodes, the interconnecting line having a connecting portion formed on the stress relieving structure;
• an external electrode being apart from the semiconductor device;
• a wire electrically connecting one of the first electrodes and the external electrode:
• and
• an electronic component having a second electrode, a bump electrically connected to the second electrode and connected to the connecting portion of the interconnecting line.

An integrated type electronic component comprising:

• a first electronic component having first electrodes, a stress relieving structure provided on the first electronic component, and an interconnecting line electrically connected to one of the first electrodes, the interconnecting line having a connecting portion formed on the stress relieving, structure;
• an external electrode being apart from the first electronic component;
• a wire electrically connecting one of the first electrodes and the external electrode;
• and
• a second electronic component having a second electrode, a bump electrically connected to the second electrode and connected to the connecting portion of the interconnecting line.