Electronic substrate, power module and motor driver
AssigneeYamaha Hatsudoki Kabushiki Kaisha
InventorsKoji Morita, Takao Yoshikawa, Takayuki Murai
Life of this patent
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Abstract
An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.
Claims15
An electronic substrate to mount a plurality of semiconductor chips thereon, the substrate comprising:
- a first conductive member, which is electrically connected to one of the semiconductor chips;
- a second conductive member, which is electrically connected to another one of the semiconductor chips;
- and
- an insulating layer for electrically isolating the second conductive member from the first conductive member;
- wherein
- the first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon;
- a connector extends through the insulating layer;
- and
- a first power supply electrode is provided on the insulating layer and is electrically connected to the conductive base by said connector.
A power module comprising:
- a plurality of power semiconductor chips;
- a first conductive member, which is electrically connected to one of the power semiconductor chips;
- a second conductive member, which is electrically connected to another one of the power semiconductor chips;
- and
- an insulating layer for electrically isolating the second conductive member from the first conductive member;
- wherein
- the first conductive member is a conductive base that supports the insulating layer, the power semiconductor chips and the second conductive member thereon;
- a connector extends through the insulating layer;
- and
- a first power supply electrode is provided on the insulating layer and is electrically connected to the conductive base by said connector.
An electronic substrate to mount a plurality of semiconductor chips thereon, the substrate comprising:
- a first conductive member, which is electrically connected to one of the semiconductor chips;
- a second conductive member, which is electrically connected to another one of the semiconductor chips;
- an insulating layer for electrically isolating the second conductive member from the first conductive member;
- and
- a conductive base that supports the first and second conductive members, the insulating layer and the semiconductor chips thereon;
- wherein
- the second conductive member is a conductive plate, which is large enough to mount at least one of the semiconductor chips thereon;
- the conductive plate is supported on the conductive base so as to cover at least a portion of the first conductive member;
- and
- the direction of a current flowing through the conductive plate is substantially opposite to that of a current flowing through the portion of the first conductive member under the conductive plate.
Dependencies are inferred from the claim text.