Efficiency CPU cooling arrangement
AssigneeDelphi Technologies, Inc.
InventorsDebashis Ghosh, Mohinder Singh Bhatti, Ilya Reyzin
Life of this patent
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Abstract
A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, conforming material (thermal grease) that is far less thermally conductive, and more resistive, than the other two layers. The relative thickness relationship of the first and third, more conductive, layers is essentially reversed from the prior art, with first layer being relatively thicker than the third. This creates an overall lower resistance for the three layer sandwich.
Claims3
In a CPU cooling assembly having a heat producing chip with an upper surface, a first layer of conductive material of thickness δ1 and having a pre determined thermal conductivity thermally bonded to the chip upper surface and also having an upper surface, a third layer of conductive material of thickness δ3 having a comparable conductivity to the first layer and having a lower surface, and a second layer of compliant conductive material of relatively small but fixed thickness δ2 and relatively high, fixed and controlling thermal resistance as compared to the other two layers, with a total conductive path thickness δt equal to the sum of δ1 δ2, and δ3, the improvement comprising,
- the ratio of the δ1 thickness to the δ3 thickness being greater than 1.0.
Dependencies are inferred from the claim text.