Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package
AssigneeLSI Logic Corporation
InventorsKishor V. Desai, Maniam B. Alagaratnam
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Abstract
A semiconductor package comprising a packaging substrate, a semiconductor die mounted with the substrate, a heatspreader, and a multi-layer heat transfer element arranged between the semiconductor die and the heat spreader to enable thermal communication between the die and the heat spreader is disclosed. The multi-layer heat transfer element includes a core spacer element sandwiched between a first layer of thermally conductive reflowable material and a second layer of thermally conductive reflowable material. Also disclosed are methods for forming such semiconductor packages and for forming multilayer heat transfer elements.
Claims15
A semiconductor package comprising:
- a packaging substrate;
- a semiconductor die having a top surface and a bottom surface having its bottom surface mounted on the substrate using solder balls;
- a heatspreader mounted at the top surface of the package;
- and
- a multi-layer heat transfer element arranged between the semiconductor die and the heat spreader to enable thermal communication between the die and the heat spreader wherein the multi-layer heat transfer element includes:
- a core spacer plate having a top surface and a bottom surface wherein the core spacer is arranged solely between the die and the heatspreader;
- a first layer of thermally conductive reflowable material formed ante top surface of the core and directly above the die configured to attach the core to the heatspreader, wherein the reflowable materials comprises a solder from the group consisting of silver containing solders, tin containing solders, lead containing solders, silicon titanium containing solders, tin silver containing solders, and tin bismuth containing solders;
- and
- a second layer of thermally conductive reflowable material formed on the bottom surface of the core to attach the core to the top surface of the die, wherein the reflowable materials comprises a solder selected from the group consisting of silver containing solders, tin containing solders, lead containing solders, silicon titanium containing solders, tin silver containing solders, and tin bismuth containing solders.
Dependencies are inferred from the claim text.