Stacked BGA packages
AssigneeSamsung Electronics Co., Ltd.
InventorJung-Jin Kim
Life of this patent
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Abstract
Provided are double stacked and multiple stacked BGA packages in which two or more BGA packages are stacked to increase the packaging density. Each of the individual BGA packages included in the stacked BGA packages includes at least one semiconductor chip and a substrate on which the chip is mounted with the substrate(s) being sized to be approximately the same size or, in some instances, slightly larger than the semiconductor chip(s) mounted thereon. A plurality of external contact terminals are provided on each of the substrates, with the corresponding external contact terminals of the multiple BGA packages being electrically connected using a flexible substrate.
Claims13
A stacked BGA package comprising:
- a lower BGA package including a first semiconductor chip having a first active surface and a first backside surface, a first substrate and first external contact terminals arranged on the first substrate;
- an upper BGA package including a second semiconductor chip having a second active surface, second backside surface, a second substrate and second external terminals arranged on the second substrate, wherein the first and second backside surfaces are attached to one another;
- and
- a flexible substrate including a plurality of wires providing electrical connection between the first external terminals and corresponding ones of the second external terminals.
Dependencies are inferred from the claim text.