Semiconductor device and method for manufacturing the same
AssigneeSanyo Electric Co., Ltd.
InventorsIsao Ochiai, Toshiyuki Take, Tetsuya Fukushima
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Abstract
A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral surface of the recessed portion (25), the exposed region of leads (26) and the reverse surface (224) of the insulating resin (22) form generally the same plane. This allows, e.g., a QFN semiconductor device (21) according to preferred embodiments herein to place dust particles in the recessed portion (25) even in the presence of dust particles such as crushed burr particles of the leads (26) or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.
Claims6
A semiconductor device, comprising
- at least one island,
- a semiconductor element fixedly attached to a surface of said island,
- a plurality of leads extending from a vicinity of said island outwardly and lifting leads extending outwardly from corner portions of said island,
- an insulating resin for covering said island, said semiconductor element, said plurality of leads, and said lifting leads integrally,
- plastic hardened between said plurality of leads exposed on said insulating resin, plastic hardened between said plurality of leads exposed on said insulating resin and said lifting leads, wherein
- an outer peripheral surface defined by surfaces of said plurality of leads, said lifting leads, and said hardened plastics is formed to a side surface of said insulating resin, and said outer peripheral surface has generally the same flat surface surrounding said insulating resin.
Dependencies are inferred from the claim text.