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US 7,119,423 B2Granted
Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument
AssigneeSeiko Epson Corporation
InventorTatsuhiro Urushido
Life of this patent
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Abstract
A semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads. The first group of leads extends in a direction away from the second group of electrodes. Each of the second group of leads extends so as to pass between the first group of electrodes and is formed to be bent in the region between first and second straight lines.
Claims6
A semiconductor device comprising:
- a substrate on which first and second groups of leads are formed;
- and
- a semiconductor chip which includes first and second groups of electrodes arranged respectively on both sides of a region between first and second parallel straight lines,
- wherein the semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads,
- wherein the first group of leads extends in a direction away from the second group of electrodes, and
- wherein each of the second group of leads extends so as to pass between the first group of electrodes and is formed to be bent in the region between first and second straight lines.
3 more elements
Dependencies are inferred from the claim text.